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| INTEGRATED CIRCUITS DATA SHEET For a complete data sheet, please also download: * The IC06 74HC/HCT/HCU/HCMOS Logic Family Specifications * The IC06 74HC/HCT/HCU/HCMOS Logic Package Information * The IC06 74HC/HCT/HCU/HCMOS Logic Package Outlines 74HC/HCT257 Quad 2-input multiplexer; 3-state Product specification Supersedes data of September 1993 File under Integrated Circuits, IC06 1998 Sep 30 Philips Semiconductors Product specification Quad 2-input multiplexer; 3-state FEATURES * Non-inverting data path * 3-state outputs interface directly with system bus * Output capability: bus driver * ICC category: MSI GENERAL DESCRIPTION The 74HC/HCT257 are high-speed Si-gate CMOS devices and are pin compatible with low power Schottky TTL (LSTTL). They are specified in compliance with JEDEC standard no. 7A. The 74HC/HCT257 have four identical 2-input multiplexers with 3-state outputs, which select 4 bits of data from two sources and are controlled by a common data select input (S). 74HC/HCT257 The data inputs from source 0 (1I0 to 4I0) are selected when input S is LOW and the data inputs from source 1 (1I1 to 4I1) are selected when S is HIGH. Data appears at the outputs (1Y to 4Y) in true (non-inverting) form from the selected inputs. The "257" is the logic implementation of a 4-pole, 2-position switch, where the position of the switch is determined by the logic levels applied to S. The outputs are forced to a high impedance OFF-state when OE is HIGH. The logic equations for the outputs are: 1Y = OE.(1I1.S + 1I0.S) 2Y = OE.(2I1.S + 2I0.S) 3Y = OE.(3I1.S + 3I0.S) 4Y = OE.(4I1.S + 4I0.S) The "257" is identical to the "258" but has non-inverting (true) outputs. QUICK REFERENCE DATA GND = 0 V; Tamb = 25 C; tr = tf = 6 ns TYPICAL SYMBOL tPHL/ tPLH PARAMETER propagation delay nI0, nI1 to nY S to nY CI CPD Notes 1. CPD is used to determine the dynamic power dissipation (PD in W): PD = CPD x VCC2 x fi + (CL x VCC2 x fo) where: fi = input frequency in MHz fo = output frequency in MHz (CL x VCC2 x fo) = sum of outputs CL = output load capacitance in pF VCC = supply voltage in V 2. For HC the condition is VI = GND to VCC For HCT the condition is VI = GND to VCC - 1.5 V input capacitance power dissipation capacitance per multiplexer notes 1 and 2 CONDITIONS HC CL = 15 pF; VCC = 5 V 11 14 3.5 45 13 17 3.5 45 ns ns pF pF HCT UNIT 1998 Sep 30 2 Philips Semiconductors Product specification Quad 2-input multiplexer; 3-state ORDERING INFORMATION TYPE NUMBER 74HC257N; 74HCT257N 74HC257D; 74HCT257D 74HC257DB; 74HCT257DB 74HC257PW; 74HCT257PW PACKAGE NAME DIP16 SO16 SSOP16 TSSOP16 DESCRIPTION plastic dual in-line package; 16 leads (300 mil); long body plastic small outline package; 16 leads; body width 3.9 mm 74HC/HCT257 VERSION SOT38-1 SOT109-1 SOT338-1 SOT403-1 plastic shrink small outline package; 16 leads; body width 5.3 mm plastic thin shrink small outline package; 16 leads; body width 4.4 mm PIN DESCRIPTION PIN NO. 1 2, 5, 11, 14 3, 6, 10, 13 4, 7, 9, 12 8 15 16 SYMBOL S 1I0 to 4I0 1I1 to 4I1 1Y to 4Y GND OE VCC NAME AND FUNCTION common data select input data inputs from source 0 data inputs from source 1 3-state multiplexer outputs ground (0 V) 3-state output enable input (active LOW) positive supply voltage fpage fpage 1 2 3 5 6 11 10 1I0 1I1 2I0 2I1 3I0 3I1 4I0 4I1 OE MGA835 S 1I0 1I1 1Y 2I0 2I1 2Y GND 1 2 3 4 16 VCC 15 OE 14 4I0 S 1Y 4 257 5 6 7 8 MLB311 13 4I1 12 4Y 11 3I0 10 3I1 9 3Y 2Y 7 3Y 9 14 13 15 4Y 12 Fig.1 Pin configuration. Fig.2 Logic symbol. Fig.3 IEC logic symbol. 1998 Sep 30 3 Philips Semiconductors Product specification Quad 2-input multiplexer; 3-state FUNCTION TABLE INPUTS OE 2 3 5 6 11 10 14 13 1I0 1I1 2I0 2I1 3I0 3I1 4I0 4I1 74HC/HCT257 OUTPUT nI1 X L H X X nY Z L H L H S X H H L L nI0 X X X L H H L 1S SELECTOR L L L 15 OE 3-STATE MULTIPLEXER OUTPUTS 1Y 4 2Y 7 3Y 12 4Y 9 MGR280 Notes 1. H = HIGH voltage level L = LOW voltage level X = don't care Z = high impedance OFF-state Fig.4 Functional diagram. Fig.5 Logic diagram. 1998 Sep 30 4 Philips Semiconductors Product specification Quad 2-input multiplexer; 3-state DC CHARACTERISTICS FOR 74HC For the DC characteristics see "74HC/HCT/HCU/HCMOS Logic Family Specifications". Output capability: bus driver ICC category: MSI AC CHARACTERISTICS FOR 74HC GND = 0 V; tr = tf = 6 ns; CL = 50 pF Tamb (C) 74HC SYMBOL PARAMETER 74HC/HCT257 TEST CONDITIONS UNIT VCC WAVEFORMS (V) 2.0 4.5 6.0 ns 2.0 4.5 6.0 ns 2.0 4.5 6.0 ns 2.0 4.5 6.0 ns 2.0 4.5 6.0 Fig.6 Fig.7 Fig.7 Fig.6 Fig.6 +25 -40 to +85 -40 to +125 min. max. 165 33 28 225 45 38 225 45 38 225 45 38 90 18 15 min. typ. max. min. max. tPHL/ tPLH propagation delay nI0 to nY; nI1 to nY tPHL/ tPLH propagation delay S to nY 36 13 10 47 17 14 33 12 10 41 15 12 14 5 4 110 22 19 150 30 26 150 30 26 150 30 26 60 12 10 140 28 24 190 38 33 190 38 33 190 38 33 75 15 13 ns tPZH/ tPZL 3-state output enable time OE to nY tPHZ/ tPLZ 3-state output disable time OE to nY tTHL/ tTLH output transition time 1998 Sep 30 5 Philips Semiconductors Product specification Quad 2-input multiplexer; 3-state DC CHARACTERISTICS FOR 74HCT For the DC characteristics see "74HC/HCT/HCU/HCMOS Logic Family Specifications". Output capability: bus driver ICC category: MSI Note to HCT types 74HC/HCT257 The value of additional quiescent supply current (ICC) for a unit load of 1 is given in the family specifications. To determine ICC per input, multiply this value by the unit load coefficient shown in the table below. INPUT nI0 nI1 OE S UNIT LOAD COEFFICIENT 0.40 0.40 1.35 0.70 AC CHARACTERISTICS FOR 74HCT GND = 0 V; tr = tf = 6 ns; CL = 50 pF Tamb (C) 74HCT SYMBOL PARAMETER min. TEST CONDITIONS UNIT VCC (V) 4.5 WAVEFORMS +25 typ. 16 -40 to +85 max. min. max. 30 38 -40 to +125 min. max. 45 tPHL/ tPLH propagation delay nI0 to nY nI1 to nY tPHL/ tPLH propagation delay S to nY tPZH/ tPZL 3-state output enable time OE to nY tPHZ/ tPLZ 3-state output disable time OE to nY tTHL/ tTLH output transition time ns Fig.6 20 15 16 5 35 30 30 12 44 38 38 15 53 45 45 18 ns ns ns ns 4.5 4.5 4.5 4.5 Fig.6 Fig.7 Fig.7 Fig.6 1998 Sep 30 6 Philips Semiconductors Product specification Quad 2-input multiplexer; 3-state AC WAVEFORMS 74HC/HCT257 (1) HC: VM = 50%; VI = GND to VCC. HCT: VM = 1.3 V; VI = GND to 3 V. (1) HC: VM = 50%; VI = GND to VCC. HCT: VM = 1.3 V; VI = GND to 3 V. Fig.6 Waveforms showing the input (nI0, nI1) to output (nY) propagation delays and the output transition times. Fig.7 Waveforms showing the 3-state enable and disable times. 1998 Sep 30 7 Philips Semiconductors Product specification Quad 2-input multiplexer; 3-state PACKAGE OUTLINES DIP16: plastic dual in-line package; 16 leads (300 mil); long body 74HC/HCT257 SOT38-1 D seating plane ME A2 A L A1 c Z e b1 b 16 9 MH wM (e 1) pin 1 index E 1 8 0 5 scale 10 mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.7 0.19 A1 min. 0.51 0.020 A2 max. 3.7 0.15 b 1.40 1.14 0.055 0.045 b1 0.53 0.38 0.021 0.015 c 0.32 0.23 0.013 0.009 D (1) 21.8 21.4 0.86 0.84 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.9 3.4 0.15 0.13 ME 8.25 7.80 0.32 0.31 MH 9.5 8.3 0.37 0.33 w 0.254 0.01 Z (1) max. 2.2 0.087 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT38-1 REFERENCES IEC 050G09 JEDEC MO-001AE EIAJ EUROPEAN PROJECTION ISSUE DATE 92-10-02 95-01-19 1998 Sep 30 8 Philips Semiconductors Product specification Quad 2-input multiplexer; 3-state 74HC/HCT257 SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 D E A X c y HE vMA Z 16 9 Q A2 A1 pin 1 index Lp 1 e bp 8 wM L detail X (A 3) A 0 2.5 scale 5 mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 1.75 0.069 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 10.0 9.8 E (1) 4.0 3.8 0.16 0.15 e 1.27 0.050 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 0.039 0.016 Q 0.7 0.6 0.028 0.020 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) 0.7 0.3 0.028 0.012 0.010 0.057 0.004 0.049 0.019 0.0100 0.39 0.014 0.0075 0.38 0.244 0.041 0.228 8 0o o Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT109-1 REFERENCES IEC 076E07S JEDEC MS-012AC EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-23 97-05-22 1998 Sep 30 9 Philips Semiconductors Product specification Quad 2-input multiplexer; 3-state 74HC/HCT257 SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm SOT338-1 D E A X c y HE vM A Z 16 9 Q A2 pin 1 index Lp L 1 bp 8 wM detail X A1 (A 3) A e 0 2.5 scale 5 mm DIMENSIONS (mm are the original dimensions) UNIT mm A max. 2.0 A1 0.21 0.05 A2 1.80 1.65 A3 0.25 bp 0.38 0.25 c 0.20 0.09 D (1) 6.4 6.0 E (1) 5.4 5.2 e 0.65 HE 7.9 7.6 L 1.25 Lp 1.03 0.63 Q 0.9 0.7 v 0.2 w 0.13 y 0.1 Z (1) 1.00 0.55 8 0o o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT338-1 REFERENCES IEC JEDEC MO-150AC EIAJ EUROPEAN PROJECTION ISSUE DATE 94-01-14 95-02-04 1998 Sep 30 10 Philips Semiconductors Product specification Quad 2-input multiplexer; 3-state 74HC/HCT257 TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1 D E A X c y HE vMA Z 16 9 Q A2 pin 1 index A1 Lp L (A 3) A 1 e bp 8 wM detail X 0 2.5 scale 5 mm DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.10 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.30 0.19 c 0.2 0.1 D (1) 5.1 4.9 E (2) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1.0 Lp 0.75 0.50 Q 0.4 0.3 v 0.2 w 0.13 y 0.1 Z (1) 0.40 0.06 8 0o o Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT403-1 REFERENCES IEC JEDEC MO-153 EIAJ EUROPEAN PROJECTION ISSUE DATE 94-07-12 95-04-04 1998 Sep 30 11 Philips Semiconductors Product specification Quad 2-input multiplexer; 3-state SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (order code 9398 652 90011). DIP SOLDERING BY DIPPING OR BY WAVE The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. REPAIRING SOLDERED JOINTS Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. SO, SSOP and TSSOP REFLOW SOLDERING Reflow soldering techniques are suitable for all SO, SSOP and TSSOP packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. 74HC/HCT257 Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. WAVE SOLDERING Wave soldering can be used for all SO packages. Wave soldering is not recommended for SSOP and TSSOP packages, because of the likelihood of solder bridging due to closely-spaced leads and the possibility of incomplete solder penetration in multi-lead devices. If wave soldering is used - and cannot be avoided for SSOP and TSSOP packages - the following conditions must be observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow and must incorporate solder thieves at the downstream end. Even with these conditions: * Only consider wave soldering SSOP packages that have a body width of 4.4 mm, that is SSOP16 (SOT369-1) or SSOP20 (SOT266-1). * Do not consider wave soldering TSSOP packages with 48 leads or more, that is TSSOP48 (SOT362-1) and TSSOP56 (SOT364-1). During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 1998 Sep 30 12 Philips Semiconductors Product specification Quad 2-input multiplexer; 3-state REPAIRING SOLDERED JOINTS 74HC/HCT257 Fix the component by first soldering two diagonally- opposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications. 1998 Sep 30 13 |
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